Epoxy and urethane-based two-component systems are meticulously engineered for high-performance bonding in industrial environments, including applications requiring adhesion to challenging substrates. These advanced formulations provide exceptional mechanical strength and chemical resistance, making them highly suitable for diverse industrial applications where reliable adhesion to demanding surfaces is paramount.
Filters: AerosolCrosslinkSolventborneMetalOTC Compliant
| Compare | Product | Description |
|---|---|---|
| ACTIVATOR 7 |
A waterborne activator for HELMIFAST adhesives, providing immediate tack and strong green strength for co-spray applications. |
|
| ACTIVATOR 8 |
A waterborne activator for HELMIFAST adhesives, providing immediate tack and strong green strength for co-spray applications. |
|
| HARDENER 561 |
VOC-free crosslinker for waterborne adhesives, enhancing bond strength, heat and water resistance. |
|
| HELMIBOND 1775 |
VOC & HAPS-free waterborne contact adhesive offering superior mileage, strength, and heat resistance, suitable for flatwork and postforming. |
|
| HELMIPLAST 8165 |
A nitrile rubber-based contact adhesive with excellent plasticizer resistance, suitable for vinyl and rubber materials where conventional adhesives fail. |
|
| HELMISTIK 1575 |
Low-VOC, zero-HAPs spray contact adhesive with long open time, aggressive tack, and high heat resistance for HPL and general lamination. |
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| HELMISTIK 1675 |
A high solids, low VOC contact adhesive with long open time, aggressive tack, and excellent heat resistance for bonding a wide range of materials. |
|
| SOLVENT 1667 |
A 50-state compliant solvent cleaner for flushing residual adhesive from hoses and spray guns before storage or product changeover. |
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| SOLVENT 667 |
Low VOC, medium/fast drying, flammable cleaning solvent for removing of adhesive residue from finished products and tools. |
|
| SOLVENT 670 |
Very fast drying, flammable solvent for the removal of HELMIPLAST polyurethane adhesive residues. Excellent for removing contact adhesive residues without redissolving the adhesive. |
