Formulated for superior strength, thermal resistance, and adaptability, these adhesives meet the demanding requirements of various industrial applications. Their primary compositions include, acrylics, polyvinyl acetate (PVA), polyurethanes (PUD) and polychloroprene. In addition to their technical performance, water borne adhesives generally have a lower environmental footprint compared to solvent-based alternatives.
Filters: WaterborneAerosolReactiveSpecialty
| Compare | Product | Description |
|---|---|---|
| HELMIBOND 816 |
Fast-setting pre-catalyzed PVA with minimal bleed-through for hardwood veneering. |
|
| HELMIBOND 8320-6 |
A waterborne contact adhesive used in the manufacture of steel fire doors. |
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| HELMIBOND 833 |
Premium Type I PVA adhesive with fast setting, rigid bonds and RF curing capability. |
|
| HELMIBOND 854 |
2-part polyurethane adhesive with low activation temp for vacuum forming and 3D laminating. |
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| HELMIBOND 870 |
Solvent-free conductive acrylic adhesive for resilient flooring with hard set bond and low odor. |
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| HELMIBOND 885 |
One-part waterborne polyurethane adhesive for low temperature 3D laminating of foils and overlays. |
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| HELMIBOND 890 |
Versatile EVA adhesive for postforming and laminating wood, metals, and plastics with high solids. |
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| HELMIBOND 894 |
Waterborne adhesive for postforming and flat laminating without cold pressing requirements. |
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| HELMICOL 3012 |
100% solids epoxy adhesive with good adhesion to many substrates offering high strength, heat and moisture resistant bonds. |
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| HELMICOL 3029 |
A two-component, solvent-free polyurethane adhesive for permanently installing luxury vinyl, rubber, and resilient flooring, with high resistance and durability. |
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| HELMICOL 3031 |
A two-component, solvent-free epoxy adhesive for nose caulking and flooring installations, offering a hard-setting bond with moisture and chemical resistance. |
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| HELMICOL 3035 |
A two-component, fast-reacting, solvent-free polyurethane adhesive for high-traffic flooring applications with excellent resistance properties. |