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HELMIPRENE NF 4510

HVAC

We have a wide selection of products including water-borne, solvent-borne and aerosol, technologies for the HVAC industry.

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HELMIPRENE NF 4510

A versatile, non-flammable spray grade contact adhesive with high heat resistance, compliant with OTC rules for adhesives and sealants.

HELMISTIK 1516

Spray grade contact adhesive for EPS and general use, with high tack and long open time. Not for decorative HPL.

HELMISTIK 1517

Fast drying, very tacky spray adhesive for holding reinforcing materials and composite matrices in place in for resin infusion processes.

HELMISTIK 1550

A fast drying, immediately aggressive spray adhesive for holding reinforcing materials and composite matrices in place during resin infusion processes. Also for bonding lightweight substrates, foam, upholstery and lightweight trim bonding applications.

HELMISTIK 1575

Low-VOC, zero-HAPs spray contact adhesive with long open time, aggressive tack, and high heat resistance for HPL and general lamination.

HELMISTIK 1580

Methylene chloride-free, high-heat-resistant spray contact adhesive for HPL and decorative overlays with fast dry and strong final bonds.

HELMISTIK 1616

A versatile, HAPs-free spray adhesive for EPS and general purpose bonding with long open time, high tack, and strong bonds to various materials.

HELMISTIK 1617

A fast drying, high tack spray adhesive for securing reinforcement materials and core components during resin infusion processes.

HELMISTIK 1635

A high solids, pressure-sensitive spray adhesive with long open time and high tack for foam, fabric, and lightweight material lamination.

HELMISTIK 1650

A very fast drying mist spray adhesive with high tack for bonding reinforcement materials, insulation, foams, and lightweight trims.

HELMISTIK 1675

A high solids, low VOC contact adhesive with long open time, aggressive tack, and excellent heat resistance for bonding a wide range of materials.

HELMISTIK 1680

High solids contact adhesive canister system offering excellent tack, bond strength, and heat resistance for bonding HPL and other overlays to core materials.

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